test equipment market
contact interfaces
probe pin locations
available
Ultra-Precision CNC Machining for Test Equipment
Semiconductor test equipment validates every chip before it ships — probing each die on the wafer and testing packaged devices for electrical performance, reliability, and thermal behavior. The mechanical components that position probe cards, handle devices, and maintain thermal contact must deliver sub-mil positional accuracy with ultra-flat contact surfaces and reliable thermal interfaces. A misaligned probe card frame or a warped thermal chuck can cause false failures and yield loss across thousands of devices per hour. We machine aluminum 6061-T6, 316L stainless steel, copper alloys, and Hastelloy to tolerances as tight as ±0.0005" with surface finishes below Ra 16 microinches on all contact and seating interfaces.
High-Conductivity Materials
We machine aluminum 6061-T6 for lightweight handler parts, copper alloys for thermal chucks, and stainless steel for wear-resistant contact housings — all with full mill certs and traceability.
Sub-Mil Positional Accuracy
We hold ±0.0005" on probe pin locations and guide features. Flatness on chuck surfaces within 0.0002" across the full contact area for uniform thermal transfer and probe alignment.
Full Inspection Documentation
Every test equipment component ships with CMM inspection reports, material certs, and surface finish verification. Full traceability for your equipment qualification and test cell validation.
Parts for Test Equipment
Probe card frames, handler parts, thermal chucks, and more — machined ultra-precise and deburr-free.
Probe Card Frames
Probe card stiffener frames and guide plates machined from aluminum 6061-T6 with precision guide pin holes, probe tip mounting locations, and card alignment features. Flatness within 0.0003" across the card diameter.
±0.0005" pin locationsHandler Components
Pick-and-place handler arms, device nests, alignment guides, and transport rails machined from aluminum and stainless steel. Precision vacuum port locations and device pocket dimensions for reliable device handling.
Aluminum & stainlessSort Interface Plates
Prober sort interface plates machined from aluminum with precision probe card seating surfaces, alignment pin holes, and vacuum clamping features. Seating surface flatness within 0.0002" for reliable electrical contact.
<Ra 8µin seatingContact Housings
Test socket contact housings machined from aluminum 6061-T6 and engineering plastics with precision pin cavities, device locating pockets, and alignment features. Pin bore concentricity within 0.001" for reliable contact.
Precision pin cavitiesThermal Chuck Plates
Thermal chuck plates machined from aluminum and copper alloys with internal cooling channels, heater pocket cavities, and ultra-flat wafer contact surfaces. Surface flatness within 0.0002" for uniform thermal contact.
Copper alloy availableBurn-In Board Fixtures
Burn-in board load plates, socket mounting frames, and device retention fixtures machined from aluminum and stainless steel. Socket cavity and pin locations held within ±0.001" for reliable device seating during burn-in testing.
±0.001" socket locationsServing the Test Equipment Industry
Every semiconductor chip must pass electrical test before it ships to a customer. Wafer probers test each die before dicing, handlers sort packaged devices at thousands of units per hour, and burn-in systems stress-test chips under extreme temperature to screen early failures.
Test equipment OEMs and test house integrators need machine shops that understand probe card alignment geometry, thermal chuck flatness requirements, and the precision contact surfaces that ensure reliable electrical measurement at production speed.
We machine test equipment components for tool builders across the US. Instant AI pricing the moment you upload your file.
Applied Materials
World's largest semiconductor equipment maker builds wafer-level inspection and test platforms requiring precision-machined stage components and probe positioning systems.
Lam Research
Leading etch equipment maker whose tools integrate endpoint detection systems requiring precision sensor mounts and test-interface components.
KLA Corporation
Process control and inspection leader whose tools require precision wafer chuck inserts, stage plates, and probe card interface components for electrical test integration.
ASML
EUV lithography systems incorporate wafer alignment and test subsystems requiring ultra-precision mechanical positioning components.
Tokyo Electron (TEL)
Major equipment OEM whose coater/developer and etch platforms integrate test interfaces and metrology feedback loops requiring precision-machined mechanical components.
Built for Test Equipment Teams
Test equipment parts need a shop that understands contact precision as well as thermal management.
Sub-Mil Positional Accuracy
We hold ±0.0005" on guide pin holes and probe tip mounting locations. Every critical feature is CMM-verified before shipping. Your probe cards seat exactly where they need to.
Full Material Traceability
Every order ships with mill certs and heat lot numbers. Complete traceability from raw aluminum, copper, or stainless billet to finished test equipment component for your tool qualification.
CMM Inspection on Every Order
We verify every critical dimension before shipping — pin locations, seating surface flatness, bore diameters, and contact interface geometry. Inspection reports go with every part.
Fast Prototype Turnaround
Your test cell development schedule does not wait. Probe card frames and thermal chucks in 5 to 7 days so your validation program keeps moving. Rush available on simple geometries.
Questions about our current quality setup? Email us — we'll send our documentation package.
From File to Part in 3 Steps
Simple, clear, and designed for fast-moving test equipment teams.
Upload & Quote
Send your STEP or IGES file. Pick your material, quantity, and finish. Our AI gives you a real price right away. We also run a free DFM check and flag anything that could affect test equipment performance.
We Machine & Inspect
Your parts run on our CNC mills and lathes. Every order gets CMM inspection. We verify pin locations, seating surface flatness, and contact geometry on every test equipment component.
Ship with Full Docs
Parts ship with dimensional inspection reports, material certs, and surface finish verification. Everything your quality team needs for test equipment qualification and test cell validation.
Other Semiconductor Sub-Industries
We machine parts for every segment of the semiconductor equipment market.
Questions from Test Equipment Teams
Test Equipment CNC Machining by City
We serve semiconductor test equipment teams in cities across the US.
Upload Your Test Equipment CAD File
Probe card frames, handler parts, thermal chucks, burn-in fixtures — we machine them all with ultra-precise, deburr-free finishes. Get instant AI pricing now.
No minimums · 100% Made in USA · Never brokered · Ships anywhere in the US
AI price estimates are usually within ±20% of final price. Complex parts may get a human review within one business day before pricing is confirmed.